| 摘要 |
PURPOSE:To reduce a void generation, improve heat dissipation, and not to cause pellet cracks generation by a method wherein wettability of a brazing material on a brazing surface of a semiconductor device is made excellent. CONSTITUTION:On at least one brazing surface of a semiconductor substrate 1 making a part of a semiconductor pellet and a heat conduction material 2 making a package, grooved parts 3 comprising V-shaped or U-shaped grooves are formed in parallel or radially. If a preform brazing material is set in a central part on the brazing surface to perform a reflow, a melted brazing material 4 can expand along the grooves all over the grooved parts 3.
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