| 摘要 |
<p>PURPOSE:To get a method of adjusting a high reliable semiconductor device by miniaturizing by reducing the number of bonding points between wirings, which connect semiconductor elements, and lessening the area of the pad parts used for bonding. CONSTITUTION:First wiring 2 and second wiring 3 for connecting semiconductor elements are made to overlap each other, and the upper wiring is bonded on the lower wiring between the said first wiring 2 and the second wiring 3 so as to decrease the number of bonding points and get conductivity.</p> |
