| 摘要 |
PURPOSE:To uniform the board thickness of a multilayer copper-clad board and to reduce the generation of a defect, such as foldings or wrinkles, in surface layer copper foils by a method wherein a pressure distribution at the time of heating and pressing the laminated material of a copper-clad board, prepregs and the surface layer copper foils is uniform mized. CONSTITUTION:Internal layer copper foils 2 on a copper-clad board 1 are patterned to form conductor circuits 2A and thereafter, a UV curing resin film 4 formed on the whole surfaces. Then, the film 4 on the circuits 2A is removed to flatten the surfaces. Then, prepregs 5 and surface layer copper foils 6 are laminated and the laminated material of the board 1, the prepregs 5 and the foils 6 are heated and pressed to manufacture a multilayer copper-clad board. |
