| 摘要 |
PURPOSE:To curtail the amount of a high-priced molybdenum in order to obtain a small-sized and low-priced integrated circuit device by a method wherein an auxiliary plate is inserted between a die frame and a wafer chip and formed of a disk having a smaller area than the area of the wafer chip. CONSTITUTION:An auxiliary disc 7 is adhered onto a die frame 6 by, for instance, solder or the like and a wafer chip is adhered onto an upper surface thereof by solder. The area of a part coming into contact with a wafer chip 3 is made smaller than that of the wafer chip 3. Therefore, when thermal expansion is generated due to heat generation of the wafer chip 3 itself or heat from outside, its stress is dispersedly produced along surroundings of the auxiliary disc 7 and the distortion due to the heat expansion is suppressed to a value corresponding not to the entire surface of the wafer chip 3 but to the area of the auxiliary disc 7, whereby cracks in the wafer chip 3 are not produced.
|
