MULTIPLE LAMINATION HIGH DENSITY INTERCONNECT PROCESS AND STRUCTURE EMPLOYING A VARIABLE CROSSLINKING ADHESIVE

摘要

A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a variable cross-linking adhesive, such for example as a SPI/epoxy crosslinking copolymer blend, in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.