COPPER THICK FILM MATERIAL SYSTEMS

摘要

THICK FILM MATERIAL SYSTEM A material system for manufacturing thick film resistors on a ceramic dielectric substrate is disclosed. The system includes the application and fixing of resistor terminations composed of a precious conductor material to a dielectric substrate. Resistor material is deposited over portions of the resistor terminations and to the dielectric substrate intermediate the resistor terminations. Terminal pads, conductor traces and resistor interconnections are printed on the dielectric substrate using a base conductor material. The resistor interconnections are deposited and fixed to the resistor terminations and to portions of the resistor material. The resistor material is trimmed to tolerance by kerfing the resistor material and a dielectric encapsulant is applied substantially over the resistor interconnections and resistor material.