| 摘要 |
PURPOSE:To enable lead pins provided to a package to be increased in number without changing mountable outer leads in pitch. CONSTITUTION:Foil leads 2d are provided to a die pad 1a, the inner leads 2e of a lower lead frame and the inner leads 2f of an upper lead frame are alternately pasted together to constitute a lead frame. A semiconductor element 4 is fixed to the die pad 1a, electrode pads 4a and the foil lead 2d are bonded together with wires, the foil leads 2d and the inner leads 2e and 2f are bonded together with wires, all the assembly concerned is sealed up with resin, the outer leads are formed into J-shaped or gull wing-shaped leads, and thus a semiconductor device is manufactured. A dense mounting package with which wire bonding can cope can be obtained. |
