| 摘要 |
PURPOSE:To prevent a semiconductor wafer, which is held with a pallet or the like by a plate spring, from being shifted. CONSTITUTION:A pallet 1 holds a wafer 4 in the direction of crossing the wafer face at right angles with a plate spring. Next, the pallet 1 is vibrated with a vibrator shown in the figure 1. At that time, the pallet 1 is given inertia being smaller than the maximum frictional force to pallet 1 of the semiconductor wafer 4 in the condition of being installed on the pallet 1. Then, the pallet 1 is transferred with a wafer transfer device. Therefore, it follows that the load which occurs by the plate spring pulling the semiconductor wafer sideways is lightened and removed beforehand before drawing since the pallet 1 vibrates. |
