| 摘要 |
<p>PURPOSE:To prevent the occurrence of cracks, stripping off, etc., by forming the outer lead pin inserting ports of a substrate so that the ports can protrude from a sealing resin. CONSTITUTION:A substrate 7 protruding from a sealing resin 1 is added to the inserting side of outer lead pins 8. As a result, the inserting ports of the pins 8 protrude from the resin 1 and molten solder does not come into contact with the resin 1 in the process for fixing the pins 8 with solder 9 and the thermal stress produced in the resin 1 is reduced. Therefore, the occurrence of cracks in the resin 1 and cracks, stripping off, etc., in a semiconductor pellet 2 can be prevented in the process for soldering 9 the pins 8.</p> |
