发明名称 HIGH-TEMPERATURE ADHESIVE COMPOSITIONS
摘要 <p>A one-coat adhesive composition which utilizes environmentally acceptable ingredients and which can withstand high temperature conditions such as those experienced during injection molding processes. The adhesive contains a Diels-Alder adduct of a perhalogenated cyclic conjugated diene and an olefinically unsaturated dienophile having a vinyl content in excess of 50 percent, a phenolic resin, an aromatic hydroxy compound, a formaldehyde donor, a heat-activated unsaturated elastomer crosslinker, a vulcanizing agent, and a metal oxide. An adhesive bond prepared with the adhesive is resistant to high temperature fluids and corrosive agents.</p>
申请公布号 WO1992018566(A1) 申请公布日期 1992.10.29
申请号 US1992002400 申请日期 1992.03.25
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