| 摘要 |
PURPOSE:To prevent a wire from being deformed and to increase the close contact strength of a connection by a method wherein, immediately after the wire at the tip of a capillary has come into contact with an inner lead, a bonding head is vibrated in the connecting direction of the wire. CONSTITUTION:When a wire 1 is bonded to an inner lead 2 by using a capillary 3, an X-Y stage 7 is vibrated in the connection direction of the wire immediately after the wire has come into contact with the inner lead, and, after that, ultrasonic waves are oscillated. Thereby, even when the oscillation intensity of the ultrasonic waves is reduced to 1/2-1/4 as compared with that in a case where a bonding head is not vibrated, the close contact intensity of the wire with the inner lead at the same level as in the case of only the ultrasonic waves is obtained. The oscillation intensity of the ultrasonic waves can be reduced, and it is possible to prevent the wire from being deformed even when the connection direction of the wire is different. Since the vibration of the X-Y stage is stable as compared with the oscillation of the ultrasonic waves, the close contact of the wire with the inner lead is stable and it is possible to reduce that the wire is stripped from the inner lead at this part. |
