| 摘要 |
PURPOSE:To obtain a lead frame where a wire is prevented from increasing in length and pins are restrained from lessening in pitch by a method wherein an inner lead is formed of a terminal composed of layers, an insulating material is provided between the terminals, and the tips of the inner leads are so formed as to enable wires which extend from different pads of a semiconductor chip to be connected to the tip of the inner leads by forming the terminals into a stepped shape. CONSTITUTION:A part 1 of an inner lead is formed into two stages. A part 2 of the inner lead is composed of a two-layered terminal, and a part 3 of the inner lead is a part of the two-layered terminal which is separated into two pieces. For instance, a lower terminal A and a terminal B which overlaps the terminal B at a certain position so as to secure the bonding area of the terminal A are provided. A polyimide resin coating is provided between the terminals A and B excluding the bonding area of the terminal A, whereby the terminal A is insulated from the terminal B. Then, the terminal B is bonded to the terminal A with epoxy adhesive agent 6. |
