发明名称 SOLDER-BEARING LEAD
摘要 A solder-bearing lead (10) for attachment to the surface of a substrate (39), wherein a discrete mass of solder (24) is mechanically held firmly by the lead (10) in a position permitting close proximity to the substrate surface to connect the lead (10) to the substrate (39) with an electrical and mechanical bond upon melting of the solder (24), the lead body having a pair of fingers (22) partially encircling the solder mass (24) with a gap (32) between the fingers (22) providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate (39) to a second substrate (44), forming a bond between conductive areas (45, 46) on both substrates.
申请公布号 WO9219024(A1) 申请公布日期 1992.10.29
申请号 WO1992US03176 申请日期 1992.04.15
申请人 NORTH AMERICAN SPECIALITIES CORPORATION 发明人 SEIDLER, JACK
分类号 H01L23/498;H01R4/02;H01R12/55;H01R43/02;H01R43/16;H05K3/34;H05K3/36 主分类号 H01L23/498
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