| 摘要 |
PURPOSE:To enable a semiconductor device to be mounted with various bonding materials different in size, to set a bonding wire excellent in form at wire bonding, and to be easily controlled in quantity. CONSTITUTION:An insulating layer 5 is formed on a mount 2 of a lead frame 1 where a die is bonded. A large number of electrodes 6 are provided to the upside of the insulating layer 5 at a certain interval. |
