发明名称 ELECTRONIC DEVICE AND FORMING METHOD THEREOF
摘要 <p>PURPOSE: To simplify the effective part of a sensor chip, i.e., a diaphragm, a sensor resistor, a conductor path and a sensor chip, by overcoming the drawback of conventional technology that the electrical connection path with a connection pin is susceptible to external effect. CONSTITUTION: A silicon chip 10 constitutes a unit along with a glass support 15 and the unit is fixed onto a casing through a connection pin for electrical contact connection of the silicon chip. The glass support 15 plunges into a through hole according to the arranging pattern of connection member 18 of a casing 17. The connection pin 18 plunges into the through hole. The through hole is filled with a conductive paste 21 which makes electrical contact connection between the silicon chip 10 and the connection pin 18 of the casing 17.</p>
申请公布号 JPH04307769(A) 申请公布日期 1992.10.29
申请号 JP19910338067 申请日期 1991.12.20
申请人 ROBERT BOSCH GMBH 发明人 SHIYUTEFUAN SHIYUMITSUTO
分类号 G01L1/18;G01L9/00;G01L9/04;H01L21/60;H01L23/12;H01L23/498;H01L23/50;H01L23/64;H01L29/84 主分类号 G01L1/18
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