MANUFACTURE OF WAFER HOLDER

摘要

PURPOSE:To form well shallow recessed portions of depth not more than several tens mum in the wafer mounting face of a wafer holder with good productivity when using dense ceramics as the base of the wafer holder such as an electrostatic chuck. CONSTITUTION:A film electrode 5 is provided on the main surface 1b of a ceramics base 1 in the form of e.g. a disk. A ceramics dielectric layer 6 is provided in such a way as covering the film electrode 5. Recessed portions 8A, 8B are formed in the wafer mounting face 22 of the ceramics dielectric layer 6 by shot blasting. A semiconductor wafer 9 is mounted on the wafer mounting face 22 and attracted thereto.