发明名称 |
PRESSURE SENSOR WITH HIGH MODULES SUPPORT |
摘要 |
A metal thin film bonds a semiconductor bonding region of a diaphragm layer to a ceramic bonding region of a high modulus support block. The arrangement isolates a pressure sensing diaphragm from undesired strain, improving sensor accuracy. A passageway through the support block couples the fluid pressure to the sensing diaphragm to deflect it. Capacitive coupling between the diaphragm and a capacitor plate on the support block sense the deflection and provide an output representative of pressure.
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申请公布号 |
US5157972(A) |
申请公布日期 |
1992.10.27 |
申请号 |
US19910677309 |
申请日期 |
1991.03.29 |
申请人 |
ROSEMOUNT INC. |
发明人 |
BRODEN, DAVID A.;BISCHOFF, BRIAN J.;LOUWAGIE, BENNETT L. |
分类号 |
G01L7/08;G01L9/00;G01L9/12;G01L13/00 |
主分类号 |
G01L7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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