发明名称 High speed bare chip test socket
摘要 An electrical socket (10) for interconnecting circuits on an integrated circuit chip to circuits on a substrate is disclosed. The socket (10) includes a base section (12), an upper section (16) and a metallized plastic membrane (14) having circuit traces (72) thereon. Contact pins (52) in the upper section (16) electrically connect circuits on the chip to inner ends (82) of the traces (72) and outer ends (84) of the traces (72) engage circuits on a substrate.
申请公布号 US5158467(A) 申请公布日期 1992.10.27
申请号 US19910786642 申请日期 1991.11.01
申请人 AMP INCORPORATED 发明人 GRABBE, DIMITRY G.;KORSUNSKY, IOSIF;RINGLER, DANIEL R.
分类号 G01R31/26;H01L21/66;H01R33/76;H05K7/10 主分类号 G01R31/26
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