| 摘要 |
Method of precision-splitting of microchips comprising creating flat layers on a chip consisting of a basic structure. The invention is characterized by so-called strips being defined lithographically in order to show the active layers or parts 9 of the structure and by slots being etched in the structure, which slots 17 after having been given a predetermined slot depth are used to split the chip along the etched slots by breaking the chip over an edge. According to the invention the method which is used to produce different layers or parts in the structure is also used to define different parts in the structure and also to produce slots in the structure which act as a breaking guide when the chip is broken. By this means the abovementioned slots are produced with the same precision as the other parts of the structure. Concerning the manufacture of laser chips the slots are made parallel with the waveguide of the laser at a fixed and very well-defined distance from the waveguide. The split surface which is produced when the chip is broken is used as a reference surface when adjusting or ruling the laser chip. <IMAGE> |
