| 摘要 |
PURPOSE:To obtain a multilayer interconnection board excellent in adhesion of layers containing a polyimide resin lawyer, by etching and eliminating the surface part effect of the polyimide resin layer which has swelled on account of the of strong alkali at the time of electroless plating of copper. CONSTITUTION:After chromium is stuck on the whole surface of an insulative substratum 1 composed of polyimide resin, a mask is formed, and a thin layer circuit 2 having a desired pattern is formed by etching. The surfaces of the insulative substratum 1 and the thin layer circuit 2 are uniformly coated with varnish of negative type polyimide precursor, and prebaking is performed. The polyimide precursor at the part position where the thin layer circuit 2 is not formed is irradiated with ultraviolet rays, and cured. The substratum is dipped in organic solvent and the not-yet-cured polyimide precursor is eliminated, thereby forming a polyimide resin layer 3. A conductor circuit 4 is formed on the thin layer circuit 2 by electroless plating. At this time, swell resin 3a formed on the resin layer 3 is dissolved and eliminated by using hydrazine hydrate. |
