发明名称 METHOD AND DEVICE FOR REFLOW SOLDERING
摘要 PURPOSE:To uniformly preheat a soldering part with respect to its temp. by providing an exhaust port and an exhaust fan for exhausting gas of the volume corresponding to that of the open air sucked from an open air inlet port of a preheating chamber, from the preheating chamber. CONSTITUTION:An exhaust port 31, and an exhaust fan 32 are provided in advance at the lower part of a hot gas passage 8 of a second zone 2 of a preheating chamber, and at the lower part of infrared-ray heaters 16, 16', respectively. In this exhaust fan 32, a flow rate adjusting damper 36 is provided. In such a way, hot gas of the volume corresponding to that of the open air sucked into a second zone 2 of the preheating chamber from an open air inlet port 18 is exhausted by the exhaust fan 32, therefore, it does not occur that hot gas leaks out of a carrying-in port and the exhaust port.
申请公布号 JPH04300066(A) 申请公布日期 1992.10.23
申请号 JP19910061453 申请日期 1991.03.26
申请人 HITACHI TECHNO ENG CO LTD 发明人 SANKAI HARUO;ITAGAKI MASATO;WADA MASABUMI
分类号 B23K1/008;B23K31/02;B23K101/42;H05K3/34 主分类号 B23K1/008
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