| 摘要 |
PURPOSE:To manufacture a multilayer interconnection board capable of preventing exfoliation, disconnection, etc., of a conductor circuit formed on the surface of an insulative coating layer, by forming said surface to be smooth. CONSTITUTION:This invention is constituted of a sequence of processes (a)-(d). In the process (a), a tungsten layer 2 as a conductor circuit of conductive material is formed on the surface of an aluminum nitride board 1 as an insulative board. In the process (b), an insulator filled layer 3 of photosensitive resin is formed in a part where the conductor circuit is not formed, by photolithography. In the process (c), a copper layer 4 as the circuit formation material is stuck on the above conductor circuit. In the process (d), an insulative coating layer 5 of resin is formed on the surfaces of the conductor circuit and the insulator filled layer of the above insulative board. Hence the gaps between the tungsten layer 2 and the insulator filled layer 3 are filled when the copper layer 4 is stuck, so that the surface of the insulative coating layer 5 is made smooth. |
