Vacuum oven for curing etch-resistant coatings in semiconductor wafer mfr. - uses combination of heat and vacuum pump extraction to remove solvent from etch-resistant layer

摘要

The oven comprises a base (1), supporting a heating plate (2), an air-tight enclosing hood (4) and a vacuum pump (5). The semiconductor wafer (4) is covered with an etch-resistant solution and placed on the heating plate and the air-tight hood secured in position. The heating plate is then raised to a temp. sufficient to evaporate the etch-resistant solution solvent and the oven pressure reduced to 13.332 mbar. The combination of heat and low atmospheric pressure ensures efficient removal of the etch-resistant solution solvent, thus improving the bonding between the etch-resistant layer and the semiconductor susbtrate and minimising the opportunity for sublimation. ADVANTAGE - Improved solvent removal and heat-resisting qualities of etch-resistant layer.