| 摘要 |
<p>PURPOSE:To enable connection of microchip capacitors with respect the power source of each IC having a plurality of power sources and realization of the area of a small-sized die attach division. CONSTITUTION:A die attach division 6a is split as many as power sources of ICs 2, and the lower electrode of a microchip capacitor 3 as many as the power sources; split electrodes are connected to split faces of the die attach divisions 6a1, 6a2, the bottom of the IC to the upper electrode of the microchip capacitor 3, and each power source of the IC 2 to each split face of the die attach division 6a1, 6a2 by wire bonding. Even when the die attach division is reduced more than that of the prior art, microchip capacitors can be encapsulated in a package as many as power sources of ICs.</p> |
