| 摘要 |
<p>PURPOSE:To easily make a pellet to be thin in thickness and suppress the generation of cracking and chipping of wafer so as to reduce the wear of dicing blade by performing dicing for a semiconductor wafer surface by shorter cutting depth than its overall thickness and then grinding the rear face of the semiconductor wafer. CONSTITUTION:A semiconductor wafer 1 is half-cut along with scribe lines by using a dicing blade 3. The depth of the half-cut grooves 4, 4... is made to be almost same as the thickness of a pellet of semiconductor device which is subjected to manufacture. A surface protecting tape 5 is stuck on the surface 1a of the semiconductor wafer 1 in order that the surface of the semiconductor 1 is protected when grinding the rear face. Then, the rear face 1b of the semiconductor 1 is etched to obtain the specified pellet thickness for the wafer 1, and the wafer 1 is pelletized. After such processing, the semiconductor wafer 1 is wet-etched to remove the deformation due to rear face grinding. Thus, the wear of dicing blade can be reduced.</p> |
