| 摘要 |
<p>PURPOSE:To cool a bare chip by increasing the number of mounting bare chips per unit area and forming heat dissipating means on an outer surface by mounting the chips in a board in a chip-in-board to be mounted on various type electronic device. CONSTITUTION:A plurality of bare chips 2 are connected to wiring patterns 11-1a formed on an inner surface of a first insulating plate 11-1, and a second insulating plate 11-2 is laminated through a laminating adhesive 11-4 thereby to seal the chip 2. A plurality of vias 11-3 are formed to conduct the patterns 11-1a to circuit patterns on both front and rear surfaces, and heat dissipating plates 11-5 are provided at positions corresponding to the chips 2 on the front and rear surfaces.</p> |
