| 摘要 |
PURPOSE:To provide a method for forming a multilayer by connecting a plurality of ceramic boards formed with circuits without heat treating at a high temperature. CONSTITUTION:A manufacturing method for a ceramic multilayer circuit board 3 having steps of so superposing a plurality of ceramic boards 1, 2 formed with circuits as to be opposed to each other through a conductively connecting material 15 at a conducting part between the boards and through an insulating connecting material 14 at the other part in the circuits, heat treating it, and connecting them, wherein a low melting point glass composition is used as the material 14. |
