| 发明名称 |
METHOD OF MAKING SEMICONDUCTOR BONDING BUMPS USING METAL CLUSTER ION DEPOSITION |
| 摘要 |
A method of making bonding bumps on the pads of an electrical chip including depositing a layer of metallic adhesion material over the surface, depositing metallic bumps on the metallic adhesion material over each of the pad areas using a focused liquid metal ion source, and chemically etching the layer of metallic adhesion material off the surface outside of the deposited bumps.
|
| 申请公布号 |
US5156997(A) |
申请公布日期 |
1992.10.20 |
| 申请号 |
US19910653609 |
申请日期 |
1991.02.11 |
| 申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION;HUGHES AIRCRAFT COMPANY |
发明人 |
KUMAR, NALIN;GORUGANTHU, RAMA R.;GHAZI, MOHAMMED K. |
| 分类号 |
H01L21/60;H01L23/485;H05K3/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
