发明名称 Vapor reflow type soldering method and apparatus therefor
摘要 In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.
申请公布号 US5156325(A) 申请公布日期 1992.10.20
申请号 US19900630811 申请日期 1990.12.20
申请人 HITACHI TECHNO ENGINEERING CO., LTD. 发明人 MISHINA, HARUO;YAMAMA, SHINYA
分类号 B23K1/015 主分类号 B23K1/015
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