| 摘要 |
PURPOSE:To provide the title metallic lead with bumps fit for mass production causing no damage to a semiconductor chip. CONSTITUTION:The bumps 11 comprising pure copper are cladjunctioned to the ends of leads 12 comprising high hardness copper. In order to manufacture said leads, the masks 4 for the leads 12 and the other masks 7 for bumps are fitted to both surfaces of a clad plate 1 composed of a thin film comprising low hardness pure copper formed on a high hardness copper thin film while the copper parts having no masks at all are etched away. At this time, the bumps comprising pure copper are so easily junctioned to the electrode of a semiconductor chip having no unfavorable effect on the semiconductor chip during the junction step. Furthermore, said leads can be manufactured by etching step fit for the mass production using no specific manufacturing devices resultantly at low cost. |
