Method of manufacturing tape automated bonding semiconductor package

摘要

This invention involves the selective plating of the outer leads in tape automated bonding section (TAB section). An inner and an outer gasket are mounted over, respectively, an inner and an outer portion of the outer leads and a voltage is applied to a common plane conductor. A barrier material, usually nickel, is applied to the outer leads protruding between the inner and the outer leads and then solder is applied over the nickel layer. The debus areas which connect all the outer leads to the common plane conductor are then excised from the TAB section which is now ready for final test.