| 摘要 |
<p>PURPOSE:To enable an electronic component to be surely and well connected to a connection terminal by a method wherein a first insulating base and a second insulating base are joined together through the intermediary of a non- flow prepreg adhesive layer. CONSTITUTION:A first insulating base material 11 and a second insulating base material 12 are jointed together through the intermediary of a non-flow prepreg adhesive layer 13 to constitute a multilayer electronic circuit board 1. The non-flow prepreg adhesive layer 13 is formed of bismaleimide triazine. The first insulating base material 11 is formed of a double-sided copper plated glass epoxy board. An electronic component mounting recess 10 is provided to the center of the base material 11, and a connection terminal 101 is provided the peripheral part of the electronic component mounting recess 10. An electronic component 5 is mounted in the recess 10 and connected to the connection terminal 101 through the intermediary of a bonding wire 51. By this setup, resin is prevented from flowing from the non-flow prepreg adhesive layer 13 to the connection terminal 101, so that the surface of the connection terminal 101 is hardly put into an insulated state.</p> |
