发明名称 THICK FILM MULTILAYER CIRCUIT SUBSTRATE
摘要 PURPOSE:To satisfactorily solder and to prevent a decrease in insulation between conductor wirings due to repetition of heating at the time of manufacturing. CONSTITUTION:Many conductor wiring layers formed of one or more gold conductor wiring layers 12 formed on an insulating base material 11 and copper conductor wiring layers 14 formed on the layers 12 are laminated.
申请公布号 JPH04293298(A) 申请公布日期 1992.10.16
申请号 JP19910058859 申请日期 1991.03.22
申请人 TOSHIBA LIGHTING & TECHNOL CORP 发明人 EZAKI SHIRO
分类号 H05K3/46 主分类号 H05K3/46
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