| 摘要 |
<p>PURPOSE:To manufacture a mounting frame by tightly bonding an adhesive tape onto a ring type frame extending over a semiconductor wafer in the omnidirections. CONSTITUTION:A ring type frame 3 is held on a lifting frame chuck table 2 while a semiconductor wafer W is held on a wafer chuck table 1 inside the table 2. On the other hand, the frame chuck table 2 is encircled by multiple radially displaceable tape tensioning members 4. An adhesive tape T is bonded onto the tape tensioning members 4 extending over the wafer W using a tape bonding roller 8 with the frame chuck table 2 in the lowered state and then the adhesive tape T is tensioned in the omnidirections by shifting the tape tensioning members 4 outward. Finally, the frame chuck table 2 is lifted up to bond the adhesive tape T onto the frame 3.</p> |
