PRODUCTION OF ALUMINUM NITRIDE SUBSTRATE CEMENTED TO COPPER

摘要

PURPOSE:To prevent insufficient close contact and cracks from occurring due to a strain in a cemented interface by the thermal expansion coefficient in cementing an aluminum nitride substrate to a copper plate. CONSTITUTION:An aluminum nitride substrate is produced by a method characterized as follows. An aluminum nitride substrate is cemented to a copper plate using an active metallic paste brazing filler to produce a circuit board. In the process, a paste brazing filler prepared by mixing active metallic powder acting as a brazing material and further powder of ceramic components therein is used to cement the aluminum nitride substrate to the copper plate.