发明名称 WAFER POSITIONING DEVICE
摘要 <p>PURPOSE:To enable the wafer delivery and the orientation flat alignment to be performed rapidly with high precision by a method wherein a wafer holding table and a holder are relatively turned so as to detect the wafer orientation flat by a detector provided on the holder. CONSTITUTION:A non contact sensor 17 as a detector mounted on the surface of a holder 37 in the peripheral part of a wafer holding table 26 is opposite to the peripheral part but in the non-opposite state to an orientation flat. Accordingly, the sensor 17 can detect the orientation flat of the wafer 1. On the other hand, a motor 55 is driven with one end of the holder 37 in the opposite state to a wafer carrier so that the holder 51a of an arm 51 may be aligned with the insertion position in the wafer carrier by driving the arm 51 in the wafer carrier direction. Next, the wafer carrier is lowered in specific dimension to deliver the wafer 1 to the holder 51a of the arm 51. Through these procedures, the wafer delivery and the orientation flat alignment can be performed rapidly with high precision.</p>
申请公布号 JPH04293251(A) 申请公布日期 1992.10.16
申请号 JP19910058767 申请日期 1991.03.22
申请人 TOSHIBA CORP 发明人 NISHIGAKI HISASHI
分类号 B23Q3/18;B65G25/08;B65G47/88;B65H9/08;H01L21/68 主分类号 B23Q3/18
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