发明名称 MANUFACTUIRNG METHOD OF WAFER MASK
摘要 The method for mfg. a mask comprises (a) coating an opaque mask plate and a photosensitive film on the transparent substrate, (b) exposing the fixed part of the plate by light-exposing and developing the fixed part of the film, (c) exposing the fixed part of the substrate by etching the exposed part of the plate, (d) forming the pattern region by etching the substrate, (e) forming a phase shift region of 0.2-0.3 m width side-etching the plate, and (f) removing the film. The mask improves the resolution of patterns.
申请公布号 KR920009369(B1) 申请公布日期 1992.10.15
申请号 KR19900007607 申请日期 1990.05.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, YONG - HYON
分类号 G03F1/29;G03F1/68;H01L21/00;H01L21/027 主分类号 G03F1/29
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