发明名称 MATRIX CIRCUIT BOARD, ITS MANUFACTURE AND DISPLAY BOARD
摘要 PURPOSE:To form a circuit of at least one of planes by solid-wiring in various meshes with metallic conductor lines insulated in advance and to quickly emit generated heat by adhering a metallic plate as a supporting plate. CONSTITUTION:Slits in plainly woven mesh-like solid wires 14 are impregnated with an insulating material and also adhered with a hold plate 2 to provide a circuit board. An insulated part with electric parts such as a cathode wire 11 and an anode wire 12 mounted which is exposed on the surface is ground to have metallic conductor lines exposed, and a monochromatic light emission diode chip 4 is adhered to the cathode wire and the anode wire via solder. The insulated part which is similarly exposed which is used for mounting the cathode wire 11 and the anode wire 12 and to be a bonding pad is ground to have metallic conductor lines exposed, so that a light emission diode bear chip 6 is adhered to the cathode wire 11 via solder and connected to the bonding pad 5 with a wire 7.
申请公布号 JPH04290478(A) 申请公布日期 1992.10.15
申请号 JP19910078344 申请日期 1991.03.19
申请人 DENKI KAGAKU KOGYO KK 发明人 SAWA HIROAKI;YOKOYAMA YOSHIHIRO;KATO KAZUO
分类号 H01L33/62;H01L33/64;H05K1/00;H05K1/02;H05K1/18 主分类号 H01L33/62
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