| 摘要 |
<p>A metal thin film (58) bonds a semiconductor bonding region (54, 56) of a diaphragm layer (50) to a ceramic bonding region (44) of a high modulus support block (40). The arrangement isolates a pressure sensing diaphragm (60) from undesired strain, improving sensor accuracy. A passageway (48) through the support block (40) couples the fluid pressure to the sensing diaphragm (60) to deflect it. Capacitive coupling between the diaphragm (60) and a capacitor plate (47) on the support block (40) sense the deflection and provide an output representative of pressure.</p> |
