| 摘要 |
<p>A method for producing coaxial connections for the input/output links of the component and/or the casing in which it is encapsulated. Specifically, the component is placed in a casing (B) and connected thereto in a conventional manner via wires, whereafter the wires are covered with a first insulating layer (21) followed by a second, conductive layer (24), so that said second layer is connected to the casing's earth contacts (PE1). The layers (21, 24) thereby form collectively produced coaxial structures with the connecting wires (F). A similar process is used for the casing's own input/output connections (P).</p> |
