发明名称 RELAY SUBSTRATE DEVICE
摘要 PURPOSE:To reduce stress at a soldered part of a connector when the connector of a printed circuit board is to be removed. CONSTITUTION:A plurality of printed secondary substrates 2 with parts mounted, printed primary substrates 1 perpendicular to the plurality of the secondary substrates 2 and further a relay substrate 9 perpendicular to the plurality of the printed primary substrates 1 are provided inside a console 3. A receiving connector 6 for permitting a connector 5 of the printed secondary substrate 2 to be fitted is provided on the printed primary substrate 1, while a receiving connector 8 for permitting a connector 7 of the printed primary substrate 1 to be fitted is provided on the relay substrate 9. Guide grooves 4b for housing and guiding the printed secondary substrates 2 and guide grooves 4a for housing and guiding the printed primary substrates 1 are respectively provided. The relay substrate 9 to be fitted into the primary substrate 1 via the connector is fixed in an inner case 10 of the console 3, wherein the inner case 10 is movably supported by a leaf spring 12 attached to an outer case 11 of the console 3.
申请公布号 JPH04290498(A) 申请公布日期 1992.10.15
申请号 JP19910054583 申请日期 1991.03.19
申请人 HITACHI LTD;HITACHI TECHNO ENG CO LTD 发明人 MATSUNO KAZUYOSHI;HONMA TETSURO;MITANI MASASHI
分类号 H01R13/64;H05K1/14;H05K7/10;H05K7/14 主分类号 H01R13/64
代理机构 代理人
主权项
地址