发明名称 POLISHING AGENT FOR SILICON WAFER
摘要 PURPOSE:To suppress generation of haze by adding the specified amount of particular anionic surface-active agent to alkali colloidal silica having mean grain size within the particular range. CONSTITUTION:The alkali colloidal silica used preferentially as pH value from 8.5 to 11.0 and also has a mean grain size, for example, of 7 to 100mmu measured by the nitrogen absorption method (BET method). As the anionic surface-active agent, the sulfonic acid salt type, sulfuric acid ester salt type, calboxylic acid salt type and phosphoric acid ester salt type agents are used. The amount of anionic surface-active agent to be added is 1ppm to 1.0wt.% in terms of the effective total component amount of a kind or several kinds of anionic surface-active agent for the solid matter of alkali colloidal silica. Thereby, haze-free silicon wafer can be obtained.
申请公布号 JPH04291723(A) 申请公布日期 1992.10.15
申请号 JP19910056744 申请日期 1991.03.20
申请人 ASAHI DENKA KOGYO KK 发明人 HIRATSUKA ICHIRO;TAKAHATA TADAO;TADA SHUICHI;KUNO JUNICHI;AZUMI TAKAYOSHI;KONISHI MASANORI
分类号 B24B37/00;C09K3/14;H01L21/304 主分类号 B24B37/00
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