发明名称 POLISHING AGENT FOR SILICON WAFER
摘要 PURPOSE:To suppress generation of haze by adding the specified amount of nonionic surface-active agent having HLB value within the particular range to alkali colloidal silica having a mean grain size within the particular range. CONSTITUTION:The alkali colloidal silica used has the mean grain size of 7 to 100mmu measured, for example, by the nitrogen absorption method (BET method). The nonionic active-surface agent is required to have the HLB value in the range from 13.0 under 20. The amount of nonion surface-active agent to be added is 1ppm to 1.0wt.% for the solidified silica included in the colloidal silica in terms of the effective total amount under the independent use or mixed use thereof. Thereby, haze-free silicon wafer surface can be obtained.
申请公布号 JPH04291722(A) 申请公布日期 1992.10.15
申请号 JP19910056743 申请日期 1991.03.20
申请人 ASAHI DENKA KOGYO KK 发明人 HIRATSUKA ICHIRO;TAKAHATA TADAO;TADA SHUICHI;KUNO JUNICHI;AZUMI TAKAYOSHI;KONISHI MASANORI
分类号 B24B37/00;C09K3/14;H01L21/304 主分类号 B24B37/00
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