| 摘要 |
PURPOSE: To prevent the lifting or damage of a connection means jointed to a separation-type bonding pad by forming the separation-type bonding pad inside. CONSTITUTION: A lead frame 20 has a heat sink 21, a lead 23, and a recess 22, a die 25 is jointed to a flag 24 of the heat sink 21, and a junction means 26 and the heat sink 21 are jointed on a separation-type bonding pad 30. Then, the separation-type bonding pad 30 is formed at a desired part on the heat sink 21 so that an electrical connection can be made from the die 25 and the lead 23 to the separation-type bonding pad 30. The separation-type bonding pad 30 comprises a raised substrate, for example, with a side wall 36 and a surface 33 that is higher than the surface of the heat sink 21, thus preventing contamination due to a die adhesive material between the connection means 26 and the heat sink 21. |
