发明名称 MANUFACTURE OF THIN FILM MULTI-LAYER SUBSTRATE
摘要 PURPOSE:To prevent residual stress from occurring in an insulation layer and also to form an insulation layer whose surface is flat with respect to manufacturing a thin film multilayer substrate. CONSTITUTION:An insulation sheet 23 and a releasing film 24 are laminated on a ceramic substrate 20, and a plate glass 25 having a flat surface 25a is mounted thereon. The insulation sheet 23 comprises a sheet body wherein polytetrafluoroethylene is subjected to foaming with ultraviolet hardening adhesive resin impregnated. Further a substrate 30 is interposed between acrylic boards 26,27 and ultraviolet rays 33 are applied with the substrate 30 compressed. The ultraviolet hardening adhesive resin is hardened to have a shape of the insulation sheet 23 solidified, so that a surface 23d of the insulation sheet 23 is flat since the flat surface 25d is transferred. Thus an insulation layer is formed without application of heat while a flat face is provided and no residual stress occurs.
申请公布号 JPH04290490(A) 申请公布日期 1992.10.15
申请号 JP19910055134 申请日期 1991.03.19
申请人 FUJITSU LTD 发明人 TOMIZAWA SHIGERU
分类号 H05K3/46 主分类号 H05K3/46
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