| 摘要 |
<p>Disclosed is a process for selective metal deposition comprising of the steps of: a) formation of an initial surface on a substrate (32), said initial surface being comprised of at least two layers of which the uppermost is inert, b) exposing the surface to a source of heat in pre-determined places where surface activation is desired, and c) deposition of metal (36) on activated portions of said surface.</p> |
