MULTILAYER CERAMIC SUBSTRATE

摘要

PURPOSE:To substantially equalize the volumetric shrinkage rates of a layer conductor in a via hole and a multilayer ceramic substrate after baking without increasing the electric resistance. CONSTITUTION:A paste composed of mixture of at least two types of metal powder having different grain size is employed in order to equalize the volumetric shrinkage rates of a baked green sheet and a layer conductor in a via hole made in a ceramic board composed of baked green sheet.