| 摘要 |
PURPOSE: To make secure each projecting lead and to easily position a semiconductor device onto a printed circuit board by forming a web that is made of the same material as that of a body between leads, projecting from the body and forming a projection at a web near the lead tip part. CONSTITUTION: A forming material, used for forming a body 202 jumps into a gap between adjacent leads 204 and completely buries a space 206. Thereby a plastic web 220 is formed between each adjacent pair of a conductive lead 204. Each web 220 has the same thickness as that of the lead 204 and has the same width as the gap of the adjacent leads 204. A projection that protrudes downward, namely a bump 222, is formed at the outer part of the webs 220. Projections 222 are formed at positions in the middle of each lead 204 and near the outer edge part of the lead 204 during forming. |
