| 摘要 |
<p>PURPOSE:To prevent contamination or production of dust at the time of sucking, and increasing a semiconductor wafer release responsiveness by installing a semiconductor wafer to an electrostatic chuck. CONSTITUTION:A susceptor 4 is installed at a bottom surface of a chamber 1 comprising a conductive material, and an upper part of the susceptor is an electrostatic chuck part 5. A voltage is applied to a film of an inner electrode 6. while a bias voltage is applied to the chamber 1. A semiconductor wafer 7 is installed to a wafer sucking surface 5a. Positive and negative ions are generated by an ionizer 3. The positive ions of these, for example, are attached to the surface of the semiconductor wafer 7 to generate Coulomb force.</p> |
