| 摘要 |
PURPOSE:To uniformize temp. distribution in a board and to enable flow soldering with high reliability by adopting hot blast heating method, in which fluctuation of the head distribution in the printed board is uniformized. CONSTITUTION:This apparatus is composed of plural hot blasting means 4 providing heaters 8 for executing hot blast heating to the board 2 fitting electronic parts, hot blast temp. detecting means for detecting the hot blast temp. in the hot blasting means 4, control part for controlling heating temp. of the heater 8 in the hot blasting means 4, condition inputting part for inputting conditions of the electronic parts, the board condition and temp., etc., according to the state of the board 2 and calculating part for calculating the set temp. of the above heater 8 according to the conditions and controlling the control part so as to uniformize the temp. distribution in the board 2 by independently executing heating of plural hot blasts according to the state of the board 2. |
